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Xinsijie 400Gbps PIN PD supports the global AI computing optical interconnection to 3.2T optical transceiver modules

2026-09-07 09:36 Chips & Hardware 🔥 42.2 heat score
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At the China International Optoelectronic Expo (CIOE) in 2026, Xinsejie officially launched a 400Gbps back-illuminated PIN photodetector chip. As a core receiving component, this product aims to support the evolution of global AI computing optical interconnection to a rate of 3.2T. The chip breaks through traditional bottlenecks in bandwidth, efficiency, and saturated current through charge compensation technology, and adopts an integrated design for back lenses to reduce manufacturing costs and yield risks. Relying on IDM’s full-chain self-research capabilities, Xinsejie controls the entire value chain from epitaxial wafer development to testing and packaging, and has established a global delivery system covering six industrial bases in Shenzhen, Xuzhou, Bengbu, Singapore, Malaysia, and Thailand. Currently, the company has developed a product matrix covering the entire rate range from 2.5Gbps to 400Gbps, and all products meet international reliability standards such as TelcordiaGR-468-CORE and automotive certification requirements like IATF16949.

Related eventsRELATED EVENTS
Key entitiesKEY ENTITIES
PHOGRAINXinsijieYang Yanwei

Event frameEVENT FRAME

Launch

芯思杰 400Gbps背照式PIN型光电探测器芯片 全球领先光电探测器芯片企业正式发布

Coverage · reports per dayLANGUAGE SPLIT

Entity relations
PHOGRAIN × Xinsijie1PHOGRAIN × Yang Yanwei1Xinsijie × Yang Yanwei1

SignalsSIGNALS

Keyword heat
  • Xinsijie1
  • PHOGRAIN1
  • Yang Yanwei1

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雷锋网 zh 2026-09-07 09:36

Xinsijie 400Gbps PIN PD supports the global AI computing optical interconnection to 3.2T optical transceiver modules

At the China International Optoelectronic Expo (CIOE) in 2026, Xinjie officially launched the 400Gbps back-illuminated PIN photodetector chip. This product provides core support for the evolution of global AI computing optical interconnection to a rate of 3.2T. This high-end chip, featuring both performance breakthroughs and technological innovations, overcomes traditional bottlenecks in bandwidth, efficiency, and saturation current through charge compensation technology, and employs an integrated design for back lenses to reduce manufacturing costs and yield risks. Relying on IDM full-chain self-research capabilities, Xinjie controls the entire value chain from epitaxial wafer development to testing and packaging, and has established a global delivery system covering six major manufacturing bases in Shenzhen, Xuzhou, Bengbu, Singapore, Malaysia, and Thailand. Currently, the company has developed a product portfolio covering the entire rate range from “2.5Gbps to 400Gbps,” and all products meet international reliability standards such as TelcordiaGR-468-CORE and automotive certification requirements like IATF16949. In the future, Xinjie will continue to deepen cooperation with global optical device manufacturers and…