Xiaomi 18 Fold is the first to be equipped with LPDDR6, and Changxin has officially announced that LPDDR6 will be mass-produced for flagship smartphones for the first time
September 7, 2026: Global launch event with LongXin LPDDR6 memory and Xuanjie O3 SoC, using a dual supplier supply guarantee.
On September 7, 2026, ChangXin Memory announced that its independently developed LPDDR6 chip had been officially put into mass production and commercial use. The single-chip capacity of this chip is 16Gb, with a packaged capacity of 16GB, and the transmission rate can reach 12800Mbps. The Xiaomi 18 Fold foldable flagship phone, as the world’s first device equipped with this memory, will be launched at the global new product launch event on the same day. To address the initial shortage of LPDDR6 production capacity, the Xiaomi 18 Fold will use a dual-supplier approach with ChangXin and SK Hynix to ensure stable supply. Previously, Xiaomi and ChangXin established a joint laboratory in 2022, forming a team of over 50 people for a year of technical coordination and debugging, and finally achieving the official application of this chip this year.
September 7, 2026: Global launch event with LongXin LPDDR6 memory and Xuanjie O3 SoC, using a dual supplier supply guarantee.
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2026-09-07
Xiaomi 18 Fold: Global launch with LongXin LPDDR6
LongXin Storage announces mass production and commercialization of LPDDR6 chips, with a single-grain capacity of 16Gb, packaging capacity of 16GB, and a maximum transfer rate of 12800Mbps. The Xiaomi 18 Fold, as the world’s first terminal device equipped with this memory, was launched at the global launch event on the same day, using a dual supplier solution from LongXin and Hynix to handle initial…
The Xiaomi 18 Fold will use a dual supplier approach with ChangXin and SK Hynix to address the capacity shortages during the initial mass production of LPDDR6. This model will be globally launched on September 7 at Xiaomi’s autumn product launch event, featuring ChangXin LPDDR6 memory and Xuanjie O3 SoC. Previously, Xiaomi officially announced that the Xiaomi 18 Fold is the world’s first terminal device equipped with ChangXin LPDDR6. Xiaomi and ChangXin established a joint laboratory in 2022, forming a core team of over 50 people to conduct one-year-long technical collaboration and joint debugging, ultimately achieving the official implementation of LPDDR6 this year.
ChangXin Memory announced that its independently developed LPDDR6 chip has been put into mass production and commercial use. It was first integrated into the Xiaomi 18 Fold foldable flagship phone, marking the first time LPDDR6 has been implemented in a flagship smartphone worldwide. The single-chip capacity is 16Gb, with a packaged capacity of 16GB. It adheres to JEDEC standards, uses 1295 Ball FBGA packaging, and can achieve a maximum transmission rate of 12800Mbps. Its bandwidth is 60% higher than LPDDR5X, and power consumption is reduced by 20%. The chip features a twin-channel architecture and dual-rail DVFS energy efficiency management, along with additional protection against row hammer attacks and built-in self-test functions. In terms of manufacturing, over 100 optimizations have been made to the key CMOS circuits; high-conductivity epoxy molding material is used in packaging, reducing thermal resistance by approximately 40%. In the future, this product will be applied in areas such as smartphones, computers, smart cars, edge servers, smart wearable devices, and robots. ChangXin Memory is accelerating its commercialization and large-scale adoption.