“The world’s first 6nm 3D wafer-level stacked advanced packaging; Xiaomi Xuanjie O100 achieves an ultra-high-side inference speed of 330TPS”

On September 7, 2026, Xiaomi officially launched its world’s first 6nm 3D wafer-level stacked advanced packaging AI acceleration chip – Xuanjie O100. This chip features a high bandwidth of 1.22TB/s and advanced bonding technology, with a bonding pitch approaching physical limits. It offers 16 times higher bandwidth than traditional mobile phone memory. Thanks to these technical features, Xuanjie O100 achieves an ultra-high-side inference speed of 330TPS.