As of September 2026, Samsung Electronics' 4nm manufacturing capacity was overburdened. Between 50% and 60% of production was allocated to manufacturing HBM4 memory chips’ base dies, with monthly production capacity reaching approximately 15,000 units. Samsung uses S5 and S6 lines at Factories No. 2 and No. 3 in Pyeongseo to produce SF4 chips to meet the requirements of HBM4 standards for integrated memory controllers and PHYs, among other custom logic circuits. Driven by high demand for artificial intelligence, Samsung, SK Hynix, and Micron are accelerating production expansion, squeezing traditional DRAM capacity. In terms of market share, Samsung’s HBM share calculated by revenue in Q2 2026 increased significantly from 15% a year ago to 38%, while SK Hynix’s share dropped from 64% to 50% during the same period. Industry estimates suggest that Samsung and SK Hynix currently have monthly HBM production capacities between 150,000 and 200,000 units, while Micron aims to reach 100,000 units by the end of this year. As customers promote diversification of suppliers…
As of September 2026, more than half of Samsung’s 4nm production capacity was dedicated to HBM4, and its memory share in Q2 rose to 38%.
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2026-09-07
Half of Samsung’s 4nm capacity is used for HBM4 base die production
Approximately half of Samsung’s SF4 production lines are allocated to HBM4 base dies, which require the integration of memory controllers and PHYs, among other custom logic circuits.
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2026-09-08
Samsung’s 4nm process operates at full capacity, leading to a surge in HBM4 orders
Samsung’s 4nm capacity is fully utilized, with 50%-60% of production allocated to HBM4 base dies, equivalent to approximately 15,000 pieces per month; driven by AI demand, Samsung, SK Hynix, and Micron are accelerating production expansion.
Samsung’s memory and foundry business has turned around thanks to a surge in HBM4 orders. 50%-60% of its 4nm production capacity is now allocated to HBM4-based chips. Previously, Samsung faced challenges such as insufficient foundry capacity utilization and AI orders being taken over by TSMC. However, with the synergy between its own memory chips and base chips, Samsung has managed to reverse its situation in HBM supply. In Q2, SK Hynix’s global share of the HBM market fell from 58% to 50%, while Samsung’s share soared from 21% to 33%. Micron’s share dropped to 18%. Following this trend, Samsung is expected to surpass SK Hynix as the leader in memory products in Q3 and Q4 this year.
Samsung Electronics’ wafer foundry division is allocating approximately half of its 4nm (SF4) process capacity to the production of HBM4 base dies. In the HBM4 and HBM4E standards, customers require custom logic circuits such as memory controllers and PHYs integrated into the base dies to reduce the chiplet footprint. Currently, Samsung manufactures SF4 chips on the S5 and S6 lines at P2 and P3 factories in Ulsan. With the growing demand for ASIC design, the demand for HBM4 capacity continues to increase. Thanks to its HBM business, Samsung’s HBM market share by revenue reached 38% in the second quarter of 2026, a significant increase from 15% a year earlier; SK Hynix’s share dropped from 64% to 50% during the same period, mainly due to customers’ efforts to diversify their supplier base. If Samsung continues to expand its capacity and introduce custom base dies, its HBM revenue share is expected to further increase in the coming quarters.
It is reported that Samsung will allocate half of its 4-nanometer production capacity to the production of HBM4 base die. Samsung Foundry, a wafer foundry division of Samsung Electronics, has reserved a large amount of production capacity for HBM4 base dies, with approximately half of the SF4 production line’s capacity dedicated to this purpose. The HBM4 and HBM4E standards require that custom logic circuits such as memory controllers and PHYs be integrated into the base die to reduce the footprint on the main computing Chiplet. Samsung currently produces SF4 chips on the S5 and S6 production lines at Plant 2 (P2) and Plant 3 (P3) in Ulsan. Thanks to its HBM business, Samsung’s HBM market share by revenue reached 38% in the second quarter of 2026, a significant increase from 15% a year earlier; SK Hynix’s share dropped from 64% to 50% during the same period. With growing market demand and diversified customer purchases, if Samsung continues to expand its production capacity and introduce custom base dies, its HBM revenue share in the coming quarters is expected to further increase…