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On September 8, 2026, domestic memory manufacturer ChangXin Semiconductor announced that its new generation LPDDR6 memory chips were unveiled and used in flagship mobile devices worldwide for the first time. Compared to previous generations, these chips have achieved significant improvements in performance and energy efficiency: data transfer bandwidth has increased by 60%, while power consumption has decreased by 20%. This release marks a historic progress in domestic memory technology, officially entering the supply chain of mainstream consumer electronics such as high-end smartphones.
长鑫存储宣布其自主研发的 LPDDR6 芯片已实现量产商用，并首发搭载于小米 18 Fold 折叠旗舰手机。该芯片单颗粒容量为 16Gb，封装容量达 16GB，遵循 JEDEC LPDDR6 标准，采用 1295 Ball FBGA 全新封装。其最高传输速率可达 12800Mbps，与 SoC 搭配速率为 10667Mbps。相比速率同为 10667Mbps 的 LPDDR5X，该芯片带宽提升 60%，功耗降低 20%。设计上采用双子通道架构及智能训练机制；能效方面采用双轨 DVFS 设计；安全性上新增每行激活计数等机制以保障数据完整性。工艺层面通过超过 100 项深度优化 CMOS 晶体管，封装环节热阻下降约 40%。未来该芯片将应用于手机、电脑、智能汽车及边缘服务器等领域。