It is reported that Micron HBM’s monthly production capacity is expected to reach 100,000 units by the end of 2026, doubling compared to last year.

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Micron expects its HBM (high-bandwidth memory) to reach a monthly production capacity of 100,000 units by the end of 2026, doubling from last year. This increase in production capacity is aimed at meeting the growing demands in high-performance computing and artificial intelligence fields.

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I IT之家 zh 2026-09-04 17:04

It is reported that Micron is actively expanding its HBM memory production capacity. The monthly number of HBM wafers it produces is expected to increase from 40,000 to 50,000 pieces by the end of 2025 to 100,000 pieces by the end of 2026, doubling its production capacity in one year. Micron focuses its HBM expansion on 12Hi HBM4, which is used in AI XPUs such as NVIDIA Rubin GPUs. It is expected that the proportion of this product in its total HBM output will rise from 20-30% at the beginning of 2026 to 50% by the end of 2026. To smoothly increase its production capacity, Micron is expanding the scale of its HBM manufacturing equipment, and relevant production equipment is continuously arriving at its production facilities in Taiwan, China, and Singapore. The industry generally estimates that the monthly production capacity of SK Hynix and Samsung Electronics is around 150,000 to 200,000 pieces, which is significantly higher than Micron’s level at the end of 2025.