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On September 9, 2026, Intel announced that the total number of wafers processed using High-NA EUV technology had exceeded 1 million. This figure includes equipment certification, testing and research, as well as the mass production of certain products, marking the official transition of this technology from laboratory validation to actual production lines. Currently, Intel has deployed at least three high-NA EUV lithography machines in Oregon for the production of some Intel 18A processes. The key layers of its Panther Lake processor have met expectations in terms of overlay accuracy, production throughput, and equipment availability, and the performance of the 18A layers produced using this technology is comparable to or even better than that of traditional 0.33 NA EUV platforms. Intel stated that customers can still meet their needs for manufacturing larger areas using existing 6-inch photomasks combined with splicing technology and process design kits (PDKs), aiming to provide more advanced and reliable process options for AI products.
英特尔晶圆代工部门宣布，采用高数值孔径极紫外光刻（High-NA EUV）技术处理的晶圆累计量已突破 100 万片。该数据涵盖设备认证、测试研发及部分产品量产环节，标志着该项技术正从实验室验证迈向实际生产线。目前，英特尔在俄勒冈州部署至少…
2 reports英特尔晶圆代工部门宣布，采用高数值孔径极紫外光刻（High-NA EUV）技术处理的晶圆累计量已突破 100 万片。该数据涵盖设备认证、测试研发及部分产品量产环节，标志着该项技术正从实验室验证迈向实际生产线。目前，英特尔在俄勒冈州部署至少三台高数值孔径EUV光刻机并用于部分 Intel 18A 制程生产，其 Panther Lake 处理器关键层在套刻精度、生产吞吐量和设备可用率等指标上达到预期。结果显示，采用该技术生产的 18A 层性能已持平甚至优于传统 0.33 数值孔径EUV平台对应层级。英特尔表示，客户目前仍可通过现有 6 英寸光掩模使用高数值孔径EUV，既可在掩模限定范围内设计芯片，也可借助拼接技术和工艺设计套件（PDK）满足更大面积制造需求。
英特尔晶圆代工部门宣布，采用高数值孔径极紫外光刻（High-NA EUV）技术处理的晶圆累计量已突破 100 万片。该数据涵盖设备认证、测试研发及部分产品量产环节，标志着该技术正从实验室验证迈向实际生产线。目前，英特尔在俄勒冈州部署至少三台高数值孔径EUV光刻机并用于部分 Intel 18A 制程生产，其 Panther Lake 处理器关键层指标均达预期。结果显示，采用新设备生产的 18A 层性能已持平甚至优于传统平台。英特尔表示，客户目前仍可通过现有 6 英寸光掩模结合拼接技术满足制造需求，旨在为 AI 产品提供更成熟、可靠的先进制程选项。