①Xinsheng Semiconductor completed tens of millions of yuan in angel and Series A financing, which will be used for the iteration of optical communication chips, vehicle-grade certification, and team expansion. ②The company’s TSPON prototype has been updated to V3.0, with latency in the microsecond range and bandwidth exceeding 10Gbps. It has already conducted joint verification with several automotive companies and Tier1 suppliers.
Beijing XinSheng Semiconductor Technology Co., Ltd. completed angel + series A financing of tens of millions of yuan, led by Zhongying Venture Capital and followed by ZhiShou Investment and LuanTu Venture Capital. The funds will be used for the engineering iteration and wafer testing of optical communication chips, advancing vehicle-grade certification, developing joint projects with leading automotive companies and Tier1 suppliers, as well as expanding the team. The company’s TSPON prototype system has been updated to V3.0, achieving time synchronization accuracy within 20 nanoseconds, end-to-end latency at the microsecond level, and bandwidth exceeding 10Gbps. It has also conducted joint verifications with several automotive companies and Tier1 suppliers. XinSheng Semiconductor was established in 2024, focusing on automotive-time-sensitive communication chips and next-generation automotive fiber-optic network communication chips and solutions. The Ministry of Industry and Information Technology’s “15th Five-Year Plan” for the development of information and communication industries, as well as relevant plans in Fujian Province, both emphasize strengthening research and development and application of automotive optical communication technologies.