EVENT DOSSIER
On September 8, 2026, Samsung Electronics, TSMC, and Intel announced their official adoption of ASML’s latest generation of high-aperture EUV lithography machines and agreed to implement a key technical change. This change is expected to significantly increase the production capacity of the new machines by approximately 40%. The cost of a single ASML machine is as high as $400 million, using strong lasers to print patterns layer by layer on silicon wafers to form circuits. This technological upgrade aims to create smaller feature sizes by using light with shorter wavelengths, thereby supporting the manufacturing of next-generation, more powerful chips for devices such as AI data centers and smartphones.
三星电子、台积电与英特尔宣布采用 ASML 最新光刻机，并同意一项关键技术变更，预计将提升新机器产能 40%。ASML 提供的高数值孔径 EUV 光刻机单台成本高达 4 亿美元，该技术使芯片设计者能在 AI 数据中心及智能手机等终端设备上制造更小特征尺寸、更强大的下一代芯片。ASML 的 EUV 光刻机利用强激光逐层在硅晶圆上印制图案以形成电路，而提升其性能需寻找波长更短的光源以创造更小特征。