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On September 8, 2026, Amazon Web Services (AWS) announced a deep partnership with Qualcomm to jointly develop custom silicon chips for artificial intelligence inference and 1.6 Tbps optical network devices. The agreement includes procurement and other commercial commitments, with a total potential value of up to 60 billion US dollars, and the payment period extends until September 2036. The cooperation involves custom silicon wafers, chip modules, or data center accelerator combinations, aiming to improve bandwidth efficiency by moving part of the computing workload to memory chips using Qualcomm technology. The relevant AI250 series platform is expected to be launched next year. Additionally, Qualcomm will provide Serializer-deserializers (SerDes) and optical digital signal processors (DSPs) to help AWS increase port speed to 1.6 Tbps, possibly involving optical pluggable components or near-copper/co-packaged optical supplies. In return, Qualcomm plans to use the AWS Bedrock platform to handle electronic design automation workloads.
亚马逊云科技（AWS）周二与高通合作，共同开发用于人工智能推理及 1.6 Tbps 光网络设备定制的硅芯片。双方协议下的采购及其他商业承诺总额可能达 600 亿美元，支付期至 2036 年 9 月。此次合作涉及定制硅、芯片块或数据中心加速器组合，旨在利用高通技术将部分计算移至内存基片以提升有效带宽，相关 AI250 系列平台预计明年推出。此外，高通还将提供 Serializer-deserializers（SerDes）及光数字信号处理器（DSP），助力 AWS 提升端口速度至 1.6 Tbps，可能涉及光学可插拔组件或近端/共封装光学供应。作为回报，高通计划利用 AWS Bedrock 平台进行电子设计自动化工作负载。