/index.html In-depth tech event tracking · Faithful summaries · Integrated timelines en /events/03c4662a9b20.html /events/03c4662a9b20.html Wed, 09 Sep 2026 07:58:52 +0800 On September 7, 2026, Huawei officially launched the Kirin 9050 Pro processor at the HarmonyOS 7 | HUAWEI Mate XT 2 and new product launch event. This chip is a new product released six years after the launch of the Kirin 9000 in the Mate 40 series. It is also the first τ chip to adopt the foldable architecture. Its internal structure features layered arrangements of logic units and additional vertical interconnect channels, significantly shortening the signal transmission path and reducing latency to enhance performance. The Mate XT 2 foldable phone equipped with this chip has improved performance by 42% compared to the Mate Xs due to deep collaboration among software, hardware, and core components. Jin Yuzhi, CEO of Huawei’s Intelligent Vehicle Solutions Department, said that in six years since the Mate 40, Kirin has achieved a new rebirth, marking a new milestone for domestic chips. /events/aa66817df844.html /events/aa66817df844.html Wed, 09 Sep 2026 08:00:00 +0800 On September 9, 2026, Intel announced that the total number of wafers processed using High-NA EUV technology had exceeded 1 million. This figure includes equipment certification, testing and research, as well as the mass production of certain products, marking the official transition of this technology from laboratory validation to actual production lines. Currently, Intel has deployed at least three high-NA EUV lithography machines in Oregon for the production of some Intel 18A processes. The key layers of its Panther Lake processor have met expectations in terms of overlay accuracy, production throughput, and equipment availability, and the performance of the 18A layers produced using this technology is comparable to or even better than that of traditional 0.33 NA EUV platforms. Intel stated that customers can still meet their needs for manufacturing larger areas using existing 6-inch photomasks combined with splicing technology and process design kits (PDKs), aiming to provide more advanced and reliable process options for AI products. /events/d722beb88eaf.html /events/d722beb88eaf.html Wed, 09 Sep 2026 07:58:52 +0800 Huawei released the Mate XT 2 extraordinary smartphone on September 7, equipped with the first Kirin 9050 Pro chip based on the Folded Logic architecture. This chip optimizes signal transmission paths through hierarchical arrangement of logic units within a single chip and the addition of vertical interconnect channels, reducing latency and enhancing performance. The overall performance of this model has improved by 42% compared to the Mate XT version. Jin Yuzhi, CEO of Huawei’s Intelligent Vehicle Solutions Department, said that since the Mate 40 was equipped with the Kirin 9000, six years have passed, and the Kirin chip has completed technological iteration and rebirth, marking a new milestone for domestic chips. /events/ce119a958da1.html /events/ce119a958da1.html Wed, 09 Sep 2026 08:00:00 +0800 On September 9, 2026, Yuji Ota, CEO of Japanese memory chip manufacturer Kioxia, publicly denied that the company was in negotiations with its competitor and shareholder, SK Hynix, regarding joint chip production. Although Chaeyom Tae-woo, chairman of SK Hynix, suggested that cooperation could help mitigate the risk of large capital investments, Ota stated that no agreement had been reached between the two parties yet, and that the plan faced anti-monopoly obstacles as well as difficulties in coordinating with existing facilities. Kioxia emphasized that memory chip prices had risen significantly; for example, the price of its NAND flash memory increased by 70% quarter over quarter as of June. To address this situation and avoid harming long-term AI demand, Kioxia has prioritized curbing rather than significantly reducing chip prices, aiming to maintain prices at current high levels. /events/2e19d8393c45.html /events/2e19d8393c45.html Wed, 09 Sep 2026 03:12:53 +0800 On September 8, 2026, Samsung Electronics, TSMC, and Intel announced their official adoption of ASML’s latest generation of high-aperture EUV lithography machines and agreed to implement a key technical change. This change is expected to significantly increase the production capacity of the new machines by approximately 40%. The cost of a single ASML machine is as high as $400 million, using strong lasers to print patterns layer by layer on silicon wafers to form circuits. This technological upgrade aims to create smaller feature sizes by using light with shorter wavelengths, thereby supporting the manufacturing of next-generation, more powerful chips for devices such as AI data centers and smartphones. /events/6277e9a96c18.html /events/6277e9a96c18.html Wed, 09 Sep 2026 00:21:57 +0800 On September 8, 2026, Amazon Web Services released a benchmark report on its machine learning blog, comparing the performance of G7, G5, and G6 GPU instances on the SageMaker AI platform. The newly launched G7 instances are equipped with NVIDIA Blackwell GPUs, achieving measurable improvements in throughput, latency, and cost per token. The tests were conducted using two scenarios: one involved using the Qwen3-Coder-30B model to compare the performance and price of ml.g5.12xlarge (A10G), ml.g6.12xlarge (L4), and ml.g7.12xlarge (RTX PRO 4500 Blackwell) instances; the other scenario used the NVIDIA Nemotron-3-Nano-30B-A3B-NVFP4 model to evaluate G6, G6e, and G7 configurations in combination with vLLM to identify the most cost-effective solution. The article also… /events/3f38699d30e8.html /events/3f38699d30e8.html Wed, 09 Sep 2026 08:19:18 +0800 2026 年 9 月 9 日，高通与亚马逊宣布达成多代定制芯片合作。双方将共同开发针对特定需求的定制化芯片解决方案，重点聚焦于后端架构优化及引入 Agent 弹性计算技术。此次合作旨在提升系统性能与资源利用率。目前，相关细节尚未在公开信息中披露具体的技术参数或交付时间表。 /events/19cd3c2d1554.html /events/19cd3c2d1554.html Wed, 09 Sep 2026 08:05:00 +0800 Arm数据中心CPU芯片的中国客户名单披露；小米18 Fold首销较上代大折叠同比增长310%；高德回应“开发扫雷榜”：确有相关产品在推进。 /events/58d98f18e7d0.html /events/58d98f18e7d0.html Wed, 09 Sep 2026 00:06:16 +0800 2026 年 9 月 8 日，Phoronix 报道 Linux 内核团队计划清理约 5.5 万行与旧版 ARM 平台相关的代码。此次清理旨在优化内核结构并提升维护效率。